Ascend 176 TOPS Embedded Computing Module

Ascend 176 TOPS Embedded Computing Module

The Ascend 176 TOPS Embedded Computing Module is powered by Huawei Ascend 310 (ZXA1610B176). It provides 176 TOPS INT8 AI computing, high integration and fast throughput for unmanned systems, tactical equipment and industrial control.
1.16-core CPU + 10-core NPU heterogeneous architecture
2.176 TOPS (INT8) / 88 TFLOPS (FP16) AI performance
3.96-channel 1080P or 12-channel 4K video decoding
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Description

The Ascend 176 TOPS Embedded Computing Module Powered by the ZXA1610B176 processor, it integrates a minimum system and 400‑pin FMC connector in a compact 140mm×80mm design.
It supports MindSpore, PyTorch, TensorFlow and PaddlePaddle, enabling fast deployment of YOLO, ResNet, ViT and other complex models. Optimized for ZaxOS 1.0, it delivers ultra‑low latency and strong fault isolation for mission‑critical applications.

 

Technical Specification

 

Category

Parameter

Technical Value

Processor

CPU

16× TAISHAN V200M @ 1.9GHz

NPU (AI Core)

10× DaVinci V300 (176 TOPS INT8 / 88 TFLOPS FP16)

Memory/Storage

RAM

24/48/96GB LPDDR4X (4266Mbps, ECC Supported)

Internal Storage

64MB SPI Flash (Supports external EMMC 5.1 HS400)

Video Decoding

H.264 / H.265

96-ch 1080P@30fps or 12-ch 4K@60fps

Video Encoding

H.264 / H.265

24-ch 1080P@30fps or 3-ch 4K@60fps

High-Speed I/O

SerDes (16 Lanes)

PCIe Gen4 (16Gbps), XFI (10.3Gbps), SATA 3.0

Low-Speed I/O

Peripheral Interfaces

6x UART, 3x I2C, 2x SPI, 2x CAN-FD, 2x MDIO

Physical

Dimensions / Weight

140 × 80 × 11 mm / 190g ± 20g

Grade

Operating Temp

M1 (-55°C to +70°C) / M2 & I (-40°C to +70°C)

Category

Parameter

Technical Value

 

Mechanical Drawing

 

product-813-469

 

product-794-458

product-780-444

 

Application Scenarios

Unmanned Combat Systems

High-tier AI "brains" for large-scale autonomous UAV swarms and UGVs.

Specialized Tactical Equipment

Real-time multi-sensor fusion and target recognition in mission-critical environments.

Industrial AI Hubs

Centralized edge processing for smart factories requiring high-channel video analytics.

Edge Data Centers

High-density AI computing for distributed intelligence networks.

 

Key Functions & Advantages

 

  1. Heterogeneous Multi-core Mastery: Seamlessly balances AI side-inference with general-purpose CPU tasks for integrated sensing and control.
  2. Flexible SerDes Configuration: 16 Lanes can be dynamically configured for high-speed PCIe Gen4 networking or massive SATA storage arrays.
  3. Extreme Video Performance: Capable of JPEG decoding at over 2048FPS (1080P), ideal for high-speed industrial vision.
  4. Next-Gen OS Integration: Built for ZaxOS 1.0, ensuring agile, reliable, and secure software architecture for the future of AI.
  5. Rugged Durability: Designed to meet GJB 10164-2021 standards, ensuring stability under extreme vibration and wide temperature ranges.

 

Product Series & Availability

 

1. Based on Huawei Ascend 310 and RK3588 series processors, the product line provides computing power ranging from 8TOPS to 176TOPS@INT8. With flexible size and power consumption, it supports intelligent control for unmanned equipment, industrial control and other fields.

2. Its core advantages include 100% domestic and independent‑controllable components, as well as high compatibility. It supports multiple operating systems, mainstream deep‑learning frameworks, abundant interfaces and dual working modes for diversified deployment.

3. Fully certified, the product series meets standard production and storage requirements in operating temperature, ensuring stable performance in harsh environments.

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